Hāʻawi ka hoʻolālā huahana hou i nā hiʻohiʻona kūʻokoʻa e kū ana i nā manaʻo o nā mea hoʻohana no ka broadband ākea a i ʻole ka hoʻokomo ʻana o NGN me nā lawelawe premium a me nā kumukūʻai haʻahaʻa haʻahaʻa.
KinoMea waiwai | Thermoplastic | Mea waiwai Hoʻopili | Ka keleawe, ka pā (Sn) plating |
ʻO ka hoʻokaʻawaleKūʻē | > 1x10^10 Ω | Hoʻopili Kūʻē | < 10 mΩ |
DielectricKa ikaika | 3000 V rms, 60 Hz AC | Voltage Kiekie Piʻi ʻana | 3000 V DC hoʻonui |
HoʻokomoPohō | <0.01 dB a i 2.2 MHz<0.02 dB a i 12 MHz<0.04 dB a hiki i 30 MHz | HoʻiPohō | > 57 dB i ka 2.2 MHz> 52 dB i 12 MHz> 43 dB a i 30 MHz |
Kūkākūkā | > 66 dB i ka 2.2 MHz> 51 dB a i 12 MHz> 44 dB a i 30 MHz | Ke hana neiMahanaKaulana | -10 °C i 60 °C |
huhū MahanaKaulana | -40 °C i 90 °C | Ka hikiwaweKa helu | UL 94 V -0 mea hoʻohana |
Uea UeaHoʻopili DC | 0.4 mm a 0.8 mm26 AWG a 20 AWG | Anana(48 Awa) | 135*133*143 (mm) |
ʻO ka poloka BRCP-SP ka mea maʻalahi i ka pilina a me ka hoʻolaha ʻana o nā lako broadband (DSLAM, MSAP/N a me BBDLC) ma nā keʻena kikowaena a me nā wahi mamao, e kākoʻo ana i ka hoʻoilina xDSL, DSL olohelohe, kaʻana like laina a i ʻole nā noi wehe laina / unbundling piha.